RongpinSamsungA15six-coreExynos5260coreboarddevelopmentboard,manufacturingprocessis28nm;mainfrequency1300MHz~1700MHz;standard2GDDR3memory+16GEMMCstorage,withAndroid4.4.2operatingsystem,hasbeenusedinRongpintwogeneration5260developmentboard.
CLICK TO BUY IMMEDIATELY RP5260C CORE BOARD>>
1.CPU BLOCK DIAGRAM
⒉MAIN HARDWARE INDICATORS
SIZE | 60*55mm |
HEIGHT | 3mm |
TECHNOLOGY | 8-Layer Plate, HDI High Strength Half-Hole Process, 8-Layer Third-Order Buried Blind PCB Process Design |
CPU | Samsung Exynos5260,Based on 2 Cortex-A15 + 4 Cortex-A7,Operating Main Frequency 200MHz~1700MHz |
GPU | Mali-600 MP |
MEMORY | 2GB DDR3 Dual-channel 32-bit bus |
STORAGE | 16GB EMMC4.5(Batch customizable 4/8GB) |
PMU | Samsung customized original distribution power management chip S2MPA01 |
WORKING VOLTAGE | 5V(Recommended use of standard 5V/3A power cord) |
PIN EXPANSION | Lead-out foot up to 184PIN, to meet the user's various practical expansion needs |
OPERATING TEMPERATURE | Form -25℃ to 75℃ |
SUPPORT SYSTEM | Android4.4.2 |
(Positive)
⒋PCB DIMENSION MAP
(Positive)
CLICK TO BUY IMMEDIATELY RP5260C CORE BOARD>>
1.CPU BLOCK DIAGRAM
⒉MAIN HARDWARE INDICATORS
SIZE | 60*55mm |
HEIGHT | 3mm |
TECHNOLOGY | 8-Layer Plate, HDI High Strength Half-Hole Process, 8-Layer Third-Order Buried Blind PCB Process Design |
CPU | Samsung Exynos5260,Based on 2 Cortex-A15 + 4 Cortex-A7,Operating Main Frequency 200MHz~1700MHz |
GPU | Mali-600 MP |
MEMORY | 2GB DDR3 Dual-channel 32-bit bus |
STORAGE | 16GB EMMC4.5(Batch customizable 4/8GB) |
PMU | Samsung customized original distribution power management chip S2MPA01 |
WORKING VOLTAGE | 5V(Recommended use of standard 5V/3A power cord) |
PIN EXPANSION | Lead-out foot up to 184PIN, to meet the user's various practical expansion needs |
OPERATING TEMPERATURE | Form -25℃ to 75℃ |
SUPPORT SYSTEM | Android4.4.2 |
(Positive)
⒋PCB DIMENSION MAP
(Positive)